VLSI
VLSI (Very Large-Scale Integration) is a research area focused on the design, fabrication, and optimization of integrated circuits (ICs) that contain millions to billions of transistors on a single chip. It plays a critical role in advancing semiconductor technology, enabling the development of faster, smaller, and more power-efficient electronic devices. VLSI research combines principles from electrical engineering, computer architecture, and material science to push the boundaries of modern electronics.
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Interested in discussing the research we are working on or learning more? Please contact:
Dr. Daryl Beetner
Professor. Director, Center for Electromagnetic Compatibility
573-341-6203 | daryl@mst.edu |
125 Emerson Electric Co. Hall
electromagnetic immunity and emissions from the integrated circuit to the system level
Dr. Minsu Choi
Associate Professor
573-341-4524 | choim@mst.edu |
134 Emerson Electric Co. Hall
Computer architecture & VLSI; embedded systems; fault tolerance; testing; quality assurance.
Dr. Chulsoon Hwang
Woodard Associate Professor for Excellence
573-341-4455 | hwangc@mst.edu |
130 Emerson Electric Co. Hall
High-speed Digital System Design, RF/digital Integration (RF Desensitization), Machine Learning in Hardware Design, Electromagnetic Interference (EMI), Hardware Security/Intentional EMI, and Electromagnetics
Dr. Lijun Jiang
Kummer Endowed Professor
573-341-4844 | ljf82@mst.edu |
120 Emerson Electric Co. Hall
Electromagnetics, EMC, Signal Integrity and Power Integrity, Microwave Engineering
Dr. Victor Khilkevich
Research Professor
573-341-4394 | khilkevichv@mst.edu |
4000 Enterprise Dr., Rolla, MO 65409
Electromagnetic compatibility
Dr. Chang-Soo Kim
Professor, ECE Graduate Coordinator
218 Emerson Electric Co. Hall
Bioinstrumentation, Sensors, Solid-state devices, Microsystems, MEMS, 3D-printed devices, Nanotechnology applications
Dr. DongHyun (Bill) Kim
Assistant Professor, and College of Engineering and Computing Dean’s Scholar
119 Emerson Electric Co. Hall #227, 4000 Enterprise Dr. Rolla, MO 65401
Signal Integrity (SI), Power Integrity (PI), and Temperature Integrity (TI); Electrostatic Discharge (ESD); High-speed SerDes Channel Modeling; High-speed Printed Circuit Board (PCB) Material Characterization; Particle Simulation on Semiconductor Devices.
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