Chulsoon Hwang is with the EMC Laboratory at Missouri S&T. He received his Ph.D. degree from KAIST, Daejeon, South Korea in 2012. From 2012 to 2015, he was with Samsung Electronics as a Senior Engineer. In 2015, he joined the Missouri S&T where he is currently an associate professor. He has authored or co-authored 150+ IEEE journal/conference papers. His research area includes RF desense, signal/power integrity, electromagnetics, and machine learning applications in hardware design.

Selected Publications

• H. Park, Y. Ding, L. Zhang, N. Bondarenko, H. Ye, B. Achkir, and C. Hwang, “High-speed Channel Transformer (HSCT): A Scalable Transformer Network-based Signal Integrity (SI) Simulator” IEEE Trans. on Electromagnetic Compatibility, vol. 66, no. 6, pp.1977-1987, Dec. 2024.

• S. Jeong, J. Kwon, D. Pai, J. Rajagopalan, and C. Hwang, “Visualization of Noise Coupling Paths based on Reciprocity Theorem” IEEE Trans. on Electromagnetic Compatibility, vol. 66, no. 5, pp. 1505-1514, Oct. 2024.

• Y. Ding, Y. Sun, R. Wolff, Z. Yang, and C. Hwang, “IBIS Model Simulation Accuracy Improvement by Including Power Supply Induced Jitter Effect” IEEE Trans. on Signal and Power Integrity, vol. 3, pp. 21-29, Jan. 2024.

• J. Joo, H. Zhang, H. Wang, Z. Liang, L. Cao, J. S. Rentmeister, and C. Hwang, “Method for Transient Behavior Modeling of a Multiphase Voltage Regulator Module for End-to-End Power Integrity Simulation,” IEEE Trans. on Signal and Power Integrity., vol. 2, pp. 122-133, 2023.

• L. Zhang, J. Juang, Z. Kiguradze, B. Pu, S. Jin, S. Wu, Z. Yang, J. Fan, and C. Hwang, “Efficient DC and AC Impedance Calculation for Arbitrary-shape and Multi-layer PDNs Using Boundary Integration” IEEE Trans. on Signal and Power Integrity, vol. 1, 2022.

• Q. Huang, T. Enomoto, S. Seto, K. Araki, J. Fan, and C. Hwang, “A Transfer Function Based Calculation Method for Radio Frequency Interference” IEEE Trans. on Electromagnetic Compatibility, vol. 61, no. 4, pp. 1280-1288, Aug. 2019.

Patents

• C. Hwang, Z. Xu, and J. Fan, “Inaudible Voice Command Injection”, U.S. patent, App. 17349268.
• J. Park, M. Leu, and C. Hwang, “Thin Cavity Resonator by using Laser Foil Printing”, U.S. patent, App. 18/953,652, Nov. 2024

Selected Honors and Awards

• Best Paper/Best Student Paper Awards (7 best papers, 4 best student papers, 4 runner-ups)
• CEC Dean’s Scholar, 2022-2023
• Outstanding Teaching Commendation, 2021
• Faculty Research Award, 2019, 2021, 2023
• IEEE Outstanding Section Member, IEEE St. Louis Section, 2024
• IEEE EMC Society Technical Achievement Award, IEEE EMC Society, 2023
• Distinguished Reviewer of the IEEE Transactions on EMC for the year 2019, IEEE T-EMC, 2020
• Google Faculty Research Award, Google, 2020
• APEMC Young Scientist Award, Joint IEEE International Symposium on EMC & Asia-Pacific Symposium on EMC, 2018
• Outstanding Graduate Student Award, received by Yifan Ding, IEEE St. Louis Section, 2024