JAMES L. DREWNIAK

Curators' Professor
114 Emerson Electric Co. Hall
and 4000 Enterprise Drive
Rolla, MO 65409-0040
Phone: 573-341-4969
Fax:  573-341-4532
drewniak@mst.edu

Areas of Interest

  • Investigation of coupling physics and numerical modeling for electromagnetic compatibility in printed and integrated circuits
  • Power electronics and electric machinery
  • Electromagnetic packaging effects and signal integrity
  • MEMS
  • Numerical electromagnetic analysis
  • RF and microwave measurements

Bio

Education

  • B.S. Electrical Engineering (highest honors), University of Illinois at Urbana-Champaign, 1985
  • M.S. Electrical Engineering, University of Illinois at Urbana-Champaign, 1987
  • Ph.D. Electrical Engineering, University of Illinois at Urbana-Champaign, 1991

 

Selected Publications

Journal Articles

  • M.Y. Koledintseva, A.V. Rakov, S. De, R. J. Stanley, S. Hinaga, J.L. Drewniak, "Quantification of conductor surface roughness profiles in printed circuit boards,” IEEE Transactions on Electromagnetic Compatibility, accepted for publication, November, 2014.
  • S. Jing, Y.-J. Zhang, J. Li, Dazhao Liu, M. Koledintseva, D. J. Pommerenke, J. L. Drewniak, and J. Fan, “Extraction of permittivity and permeability for ferrites and flexible magnetodelectric  materials using a genetic algorithm, “IEEE Transactions on Electromagnetic Compatibility, accepted for publication, July, 2014.
  • M.Y. Koledintseva, A.V. Rakov, A.I. Koledintsev, J.L. Drewniak, and S. Hinaga, “Improved experiment-based technique to characterize dielectric properties of printed circuit boards,” IEEE Transactions on Electromagnetic Compatibility, no., pp. , 2014. (in press)
  • Guo, X., Jackson, D.R., Koledintseva, M.Y., Hinaga, S., Drewniak, J.L., Chen, J., “An analysis of conductor surface roughness effects on signal propagation for stripline interconnects,” IEEE Transactions on Electromagnetic Compatibility, no. , pp. , 2014.
  • Ren, L., Li, T., Chandra, S., Chen, X., Bishnoi, H., Sun, S., Boyle, P., Zamek, I., Fan, J., Beetner, D.G., Drewniak, J.L., “Prediction of power supply noise from switching activity in an FPGA,” IEEE Transactions on Electromagnetic Compatibility, no. , pp. , 2014.
  • de Paulis, F., Nisanci, M.H., Orlandi, A., Koledintseva, M.Y., Drewniak, J.L., “Design of homogeneous and composite materials from shielding effectiveness specifications,” IEEE Transactions on Electromagnetic Compatibility, vol. 56, no 2., pp. 343-351, April 2014 .

 

Conference Papers

  • Liu, Q., Jiao, X., Li, J., Khilkevich, V., Drewniak, J., Dixon, P., Arien, Y., “Modeling absorbing materials for EMI mitigation,” IEEE International Symp. Electromag. Compat., Dresden, Germany, August 2015, pp. 1548-1552.
  • Li, J., Zhang, Y., Liu, D., Bhobe, A., Drewniak, J.L., Fan, J., “Radiation physics from two-wire transmission lines,” IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015, Santa Clara, CA, March 2015, pp. 160-164.
  • Tsiklauri, M., Zvonkin, M., Dikhaminjia, N., Fan, J., Drewniak, J.L., “Frequency-domain interpolation of long structures for system-level signal integrity analysis,” IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015, Santa Clara, CA, March 2015, pp. 335-340.
  • Qi, Y., Fan, J., Bi, Y.H., Yu, W., Drewniak, J.L., “ A planar low-profile meander antenna design for wireless terminal achieving low self-interference,” IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015, Santa Clara, CA, March 2015, pp. 320-323.
  • Zhao, B., Huang, C., Shringarpure, K., Fan, J., Archambeault, B., Achkir, B., Connor, S., Cracraft, M., Cocchini, M., Ruehli, A. and Drewniak, J.L., “Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN,” IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015, Santa Clara, CA, March 2015, pp. 133-138.
  • Tian, X., Halligan, H.,  Li, X.,  Kim,K.,  Chen, H., Connor, S.,  Archambeault, B., Cracraft, M., Ruehli, A., Drewniak, J.L., “Modeling Electromagnetic Radiation at High‐Density PCB/Connector Interfaces,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 97-102.
  • Jiao, X. ,  Maheshwari, P.,  Khilkevich, V., Pommerenke, D.,  Dixon, P.,  Arien, Y., Bhobe, A., Li, J., Li, X., Pommerenke, D., Drewniak, J.L., “EMI mitigation with lossy material at 10GHz,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 150-154.
  •  Shringarpure, K. ,  Zhao, B.,  Wei, L., Archambeault, B.,  Ruehli, A.,  Cracraft, M.,  Cocchini, M.,  Wheeler, E., Fan, J., Drewniak, J.L., “On Finding the Optimal Number of Decoupling Capacitors by Minimizing the Equivalent Inductance of the PCB PDN,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 218-223.
  • Li, J. ,  Toor, S.,  Bhobe, A.,  Drewniak, J.L., Fan, J., “Radiation Physics and EMI Coupling Path Determination for Optical Links,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 576-581.
  • Yoon, C. ,  Tsiklauri, M.,  Zvonkin, M., Razmadze, A.,  Aflaki, A.,  Kim, J.,  Chen, B., Fan, J., Drewniak, J.L., “Design Criteria of Automatic Fixture Removal (AFR) for Asymmetric Fixture De‐embedding,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 654-659.
  • Shringarpure, K. ,  Zhao, B.,  Archambeault, B.,  Ruehli, A.,  Fan, J., Drewniak, J.L., “Effect of Narrow Power Fills on PCB PDN Noise,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 839-844.
  • Tsiklauri, M. ,  Zvonkin, M.,  Fan, J., Drewniak, J.L., “Causality and Delay and Physics in Real Systems,” IEEE International Symp. Electromag. Compat., Raleigh, NC, August 2014, pp. 961-966.
  • Chada, A.R., Fan, J., Drewniak, J.L., Mutnury, B. , “Estimation of mode conversion and crosstalk impact from a single-ended aggressor to a differential victim using statistical BER analysis,” IEEE 64th Electronic Components and Technology Conference, ECTC 2014, Orlando, FL, May 2014, pp. 2081-2087.
  • Koledintseva, M.Y., Rakov, A.V., Koledintsev, A.I., Drewniak, J.L., Hinaga, S., “Elimination of conductor foil roughness effects in characterization of dielectric properties of printed circuit boards,” DesignCon2014.

 

Selected Awards

 

  • (the 2014 paper awards are announced and awarded at the 2015 EMC Symposium)De Paulis, F.Nisanci, M.H.Orlandi, A.Koledintseva, M.Y.Drewniak, J.L., “Design of homogeneous and composite materials from shielding effectiveness specifications,” IEEE Transactions on Electromagnetic Compatibility, vol. 56, no 2., pp. 343-351, April 2014 .  (2014 Richard Schulz Prize Paper Award Honorable Mention)
  • IEEE Fellow, 2007
  • IEEE EMC Society Stoddart Award (EMC-S highest award for technical achievement), 2013
  • Best Paper, IEEE International EMC Symposium 2012
  • Honorable Mention Paper, IPC 2009 APEX/EXPO, March 2009
  • Best Paper, DesignCon2007, PDN Track, 2007
  • Curators’ Professor of Electrical and Computer Engineering, 2007
  • Technical Achievement Award, IEEE EMC Society, 2006
  • Best Paper, IEEE International EMC Symposium 2006
  • IBM Faculty Award 2006, 2007, 2008
  • UMR Faculty Excellence Award, 1997, 1998, 1999, 2000, 2001, 2002, 2003, 2004, 2005, 2006
  • UMR School of Engineering Outstanding Teaching Award 2004-2005, 2005-2006